The effects of heat and thermal management of structure is very much needed as the engineers are working to improve the performance of system by lighter, smaller and more smarter designs. Thermal phenomenon such as conduction, convection and radiation has greater effects on products. Computational thermal analysis helps to analyze the thermal loads acting on the structures. It also provides better understanding of the product’s response to aforementioned phenomena and helps engineers to provide an optimum design that can withstand thermal loads.
WHAT WE DO?
STEADY STATE THERMAL ANALYSIS
Steady-state thermal analysis is used to determine temperatures, thermal gradients, heat flow rates, and heat fluxes in an object that are caused by thermal loads that do not vary over time. A steady-state thermal analysis calculates the effects of steady thermal loads on a system or component.
TRANSIENT THERMAL ANALYSIS
Transient thermal analyses helps to determine temperatures and other thermal quantities that vary over time. The variation of temperature distribution over time is of interest in many applications such as with cooling of electronic packages or a quenching analysis for heat treatment. Many heat transfer applications such as heat treatment problems, electronic package design, nozzles, IC engine blocks, industrial pressure vessels, fluid-structure interaction problems, and so on involve transient thermal analyses.